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  1. Abstract

    As an alternative to traditional photolithography, printing processes are widely explored for the patterning of customizable devices. However, to date, the majority of high‐resolution printing processes for functional nanomaterials are additive in nature. To complement additive printing, there is a need for subtractive processes, where the printed ink results in material removal, rather than addition. In this study, a new subtractive patterning approach that uses electrohydrodynamic‐jet (e‐jet) printing of acid‐based inks to etch nanoscale zinc oxide (ZnO) thin films deposited using atomic layer deposition (ALD) is introduced. By tuning the printing parameters, the depth and linewidth of the subtracted features can be tuned, with a minimum linewidth of 11 µm and a tunable channel depth with ≈5 nm resolution. Furthermore, by tuning the ink composition, the volatility and viscosity of the ink can be adjusted, resulting in variable spreading and dissolution dynamics at the solution/film interface. In the future, acid‐based subtractive patterning using e‐jet printing can be used for rapid prototyping or customizable manufacturing of functional devices on a range of substrates with nanoscale precision.

     
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  2. Abstract

    A customized atmospheric‐pressure spatial atomic layer deposition (AP‐SALD) system is designed and implemented, which enables mechatronic control of key process parameters, including gap size and parallel alignment. A showerhead depositor delivers precursors to the substrate while linear actuators and capacitance probe sensors actively maintain gap size and parallel alignment through multiple‐axis tilt and closed‐loop feedback control. Digital control of geometric process variables with active monitoring is facilitated with a custom software control package and user interface. AP‐SALD of TiO2is performed to validate self‐limiting deposition with the system. A novel multi‐axis printing methodology is introduced usingxyposition control to define a customized motion path, which enables an improvement in the thickness uniformity by reducing variations from 8% to 2%. In the future, this mechatronic system will enable experimental tuning of parameters that can inform multi‐physics modeling to gain a deeper understanding of AP‐SALD process tolerances, enabling new pathways for non‐traditional SALD processing that can push the technology towards large‐scale manufacturing.

     
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